STN EN IEC 63378-3
| Name: | STN EN IEC 63378-3 |
| Validity: | Valid |
| Number of pages: | 20 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Tepelná normalizácia polovodičových puzdier. Časť 3: Simulačné modely tepelných obvodov diskrétnych polovodičových puzdier pre prechodovú analýzu |
| English title | Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis |
| Release Date: | 01. 11. 2025 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8790 |
| Level of incorporation: | idt EN IEC 63378-3:2025, idt IEC 63378-3:2025 |
| Official Journal | 10/25 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices. |
| Preview: | Náhľad normy (PDF) |