STN EN 60749-20
| Name: | STN EN 60749-20 |
| Validity: | Withdrawn |
| Number of pages: | 27 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 20: Odolnosť plastových puzdier SMD proti kombinovanému pôsobeniu vlhka a spájkovacieho tepla |
| English title | Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat |
| Release Date: | 01. 01. 2004 |
| Date of withdrawal: | 01. 09. 2012 |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt IEC 60749-20:2002, idt EN 60749-20:2003 |
| Official Journal | 12/03 |
| Amendments | |
| Replaced by: | STN EN 60749-20:2010-04 (35 8799) |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: |