STN EN IEC 62148-21
Name: | STN EN IEC 62148-21 |
Validity: | Withdrawn |
Number of pages: | 20 |
Language: |
EN
|
Paper: | 14,10€ |
Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
Slovak title | Optovláknové aktívne súčiastky a prvky. Normy na puzdro a rozhranie. Časť 21: Konštrukčný návrh elektrického rozhrania PIC puzdier s S-FBGA a S-FLGA |
English title | Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) |
Release Date: | 01. 08. 2019 |
Date of withdrawal: | 27. 05. 2024 |
ICS: | 33.180.20 |
Sorting character/National clasification code | 35 9255 |
Level of incorporation: | idt EN IEC 62148-21:2019, idt IEC 62148-21:2019 |
Official Journal | 07/19 |
Amendments | |
Replaced by: | STN EN IEC 62148-21:2021-09 (35 9255) |
Repleces: | |
Note in Official Journal: | |
Subject of the standard: | This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. |
Preview: | Náhľad normy (PDF) |