STN EN IEC 60749-30
| Name: | STN EN IEC 60749-30 |
| Validity: | Valid |
| Number of pages: | 20 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 30: Predpríprava nehermetických súčiastok na povrchovú montáž pred skúšaním spoľahlivosti |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| Release Date: | 01. 01. 2021 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-30:2020, idt IEC 60749-30:2020 |
| Official Journal | 12/20 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-30:2005-09 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications. |
| Preview: | Náhľad normy (PDF) |