STN EN IEC 61760-3
| Name: | STN EN IEC 61760-3 |
| Validity: | Valid |
| Number of pages: | 36 |
| Language: |
EN
|
| Paper: | 17,20€ |
| Electronic version |
a) Only read (without ability to print and copy)
15,48€ b) Without ability to print, with ability to copy (printscreen) 17,20€ c) With ability to print and copy (printscreen) 22,36€ |
| Slovak title | Technológia povrchovej montáže. Časť 3: Štandardná metóda špecifikácie súčiastok pri spájkovaní pretavením cez otvor (THR) |
| English title | Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering |
| Release Date: | 01. 07. 2021 |
| Date of withdrawal: | |
| ICS: | 31.190 |
| Sorting character/National clasification code | 35 9310 |
| Level of incorporation: | idt IEC 61760-3:2021, idt EN IEC 61760-3:2021 |
| Official Journal | 06/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 61760-3:2010-09 (35 9310) |
| Note in Official Journal: | |
| Subject of the standard: | This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology. |
| Preview: | Náhľad normy (PDF) |