STN EN IEC 60068-2-20
| Name: | STN EN IEC 60068-2-20 |
| Validity: | Valid |
| Number of pages: | 28 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Skúšanie vplyvu prostredia. Časť 2-20: Skúšky. Skúška Ta a Tb: Skúšobné metódy spájkovateľnosti a odolnosti súčiastok s vývodmi proti spájkovaciemu teplu |
| English title | Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads |
| Release Date: | 01. 08. 2021 |
| Date of withdrawal: | |
| ICS: | 19.040 |
| Sorting character/National clasification code | 34 5791 |
| Level of incorporation: | idt EN IEC 60068-2-20:2021, idt IEC 60068-2-20:2021 |
| Official Journal | 07/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60068-2-20:2009-06 (34 5791) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. |
| Preview: | Náhľad normy (PDF) |