STN EN IEC 60749-10
| Name: | STN EN IEC 60749-10 |
| Validity: | Valid |
| Number of pages: | 20 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 10: Mechanický náraz. Zariadenie a podzostava |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly |
| Release Date: | 01. 09. 2022 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-10:2022, idt IEC 60749-10:2022 |
| Official Journal | 08/22 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-10:2003-02 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. |
| Preview: | Náhľad normy (PDF) |