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STN EN IEC 60749-37

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Name: STN EN IEC 60749-37
Validity: Valid
Number of pages: 28
Language:
EN
Paper: 14,10€
Electronic version a) Only read (without ability to print and copy) 12,69€
b) Without ability to print, with ability to copy (printscreen) 14,10€
c) With ability to print and copy (printscreen) 18,33€
Slovak title Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 37: Skúšobná metóda pádom osadenej dosky s použitím merača zrýchlenia
English title Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Release Date: 01. 02. 2023
Date of withdrawal:
ICS: 31.080.01
Sorting character/National clasification code 35 8799
Level of incorporation: idt EN IEC 60749-37:2022, idt IEC 60749-37:2022
Official Journal 01/23
Amendments
Replaced by:
Repleces: STN EN 60749-37:2008-11 (35 8799)
Note in Official Journal:
Subject of the standard: IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.
Preview: Náhľad normy (PDF)