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STN EN IEC 60749-22-2

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Name: STN EN IEC 60749-22-2
Validity: Valid
Number of pages: 44
Language:
EN
Paper: 18,90€
Electronic version a) Only read (without ability to print and copy) 17,01€
b) Without ability to print, with ability to copy (printscreen) 18,90€
c) With ability to print and copy (printscreen) 24,57€
Slovak title Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 22-2: Pevnosť spojenia. Skúšobné metódy skúšky strihom drôtového spoja
English title Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
Release Date: 01. 04. 2026
Date of withdrawal:
ICS: 31.080.01
Sorting character/National clasification code 35 8799
Level of incorporation: idt EN IEC 60749-22-2:2026, idt IEC 60749-22-2:2025
Official Journal 03/26
Amendments
Replaced by:
Repleces: STN EN 60749-22:2004-01 (35 8799)
Note in Official Journal:
Subject of the standard: IEC 60749-22-2:2025 establishes a means for determining the strength of a ball bond to a die or package bonding surface and can be performed on pre-encapsulation or post-encapsulation devices. This measure of bond strength is extremely important in determining two features: a) the integrity of the metallurgical bond which has been formed, and b) the quality of ball bonds to die or package bonding surfaces. This test method covers thermosonic (ball) bonds made with small diameter wire from 15 µm to 76 µm (0,000 6" to 0,003"). This test method can only be used when the bonds are large enough to allow for proper contact with the shear test chisel and when there are no adjacent interfering structures that would hinder the movement of the chisel. For consistent shear results the ball height will be at least 4,0 µm (0,000 6 ") for ball bonds, which is the current state of the art for bond shear test equipment at the time of this revision. This test method can also be used on ball bonds that have had their ...
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