STN EN IEC 60749-21
| Označenie: | STN EN IEC 60749-21 |
| Platnosť: | Platná |
| Počet strán: | 28 |
| Jazyk: |
EN
|
| Listinná verzia: | 14,10€ |
| Elektronická verzia: |
a) Bez možnosti tlače, prenosu textu a obrázkov:
12,69€ b) Bez možnosti tlače, s prenosom textu a obrázkov: 14,10€ c) S možnosťou tlače, prenosu textu a obrázkov: 18,33€ |
| Slovenský názov: | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 21: Spájkovateľnosť |
| Anglický názov: | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| Dátum vydania: | 01. 05. 2026 |
| Dátum zrušenia: | |
| ICS: | 31.080.01 |
| Triediaci znak: | 35 8799 |
| Úroveň zapracovania: | idt EN IEC 60749-21:2026, idt IEC 60749-21:2025 |
| Vestník: | 04/26 |
| Zmeny: | |
| Nahradzujúce normy: | |
| Nahradené normy: | STN EN 60749-21:2011-12 (35 8799) |
| Poznámka vo Vestníku: | |
| Predmet normy: | IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749-15 or IEC 60749-20. NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69. This edition ... |
| Náhľad normy: | Náhľad normy (PDF) |