STN EN IEC 60749-21
| Name: | STN EN IEC 60749-21 |
| Validity: | Valid |
| Number of pages: | 28 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 21: Spájkovateľnosť |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| Release Date: | 01. 05. 2026 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-21:2026, idt IEC 60749-21:2025 |
| Official Journal | 04/26 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-21:2011-12 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749-15 or IEC 60749-20. NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69. This edition ... |
| Preview: | Náhľad normy (PDF) |