STN EN IEC 60749-20-1
| Označenie: | STN EN IEC 60749-20-1 |
| Platnosť: | Platná |
| Počet strán: | 48 |
| Jazyk: |
EN
|
| Listinná verzia: | 18,90€ |
| Elektronická verzia: |
a) Bez možnosti tlače, prenosu textu a obrázkov:
17,01€ b) Bez možnosti tlače, s prenosom textu a obrázkov: 18,90€ c) S možnosťou tlače, prenosu textu a obrázkov: 24,57€ |
| Slovenský názov: | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 20-1: Manipulácia, balenie, označovanie a preprava súčiastok na povrchovú montáž citlivých na kombinované pôsobenie vlhka a spájkovacieho tepla |
| Anglický názov: | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| Dátum vydania: | 01. 05. 2026 |
| Dátum zrušenia: | |
| ICS: | 31.080.01 |
| Triediaci znak: | 35 8799 |
| Úroveň zapracovania: | idt IEC 60749-20-1:2019, idt EN IEC 60749-20-1:2026 |
| Vestník: | 04/26 |
| Zmeny: | |
| Nahradzujúce normy: | |
| Nahradené normy: | STN EN 60749-20-1:2009-09 (35 8799) |
| Poznámka vo Vestníku: | |
| Predmet normy: | IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to ... |
| Náhľad normy: | Náhľad normy (PDF) |