STN EN IEC 60749-20-1
| Name: | STN EN IEC 60749-20-1 |
| Validity: | Valid |
| Number of pages: | 48 |
| Language: |
EN
|
| Paper: | 18,90€ |
| Electronic version |
a) Only read (without ability to print and copy)
17,01€ b) Without ability to print, with ability to copy (printscreen) 18,90€ c) With ability to print and copy (printscreen) 24,57€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 20-1: Manipulácia, balenie, označovanie a preprava súčiastok na povrchovú montáž citlivých na kombinované pôsobenie vlhka a spájkovacieho tepla |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| Release Date: | 01. 05. 2026 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt IEC 60749-20-1:2019, idt EN IEC 60749-20-1:2026 |
| Official Journal | 04/26 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-20-1:2009-09 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to ... |
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