STN EN IEC 60749-23
| Name: | STN EN IEC 60749-23 |
| Validity: | Valid |
| Number of pages: | 16 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 23: Životnosť pri vysokej teplote |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
| Release Date: | 01. 05. 2026 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-23:2026, idt IEC 60749-23:2025 |
| Official Journal | 04/26 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-23:2004-10 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated. |
| Preview: | Náhľad normy (PDF) |