STN EN 60191-6-4
Name: | STN EN 60191-6-4 |
Validity: | Valid |
Number of pages: | 19 |
Language: |
EN
|
Paper: | 14,10€ |
Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
Slovak title | Normalizácia rozmerov polovodičových súčiastok. Časť 6-4: Všeobecné pravidlá na prípravu výkresov puzdier polovodičových súčiastok na povrchovú montáž. Metódy merania rozmerov puzdier s guľovými pripojeniami (BGA) |
English title | Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) |
Release Date: | 01. 03. 2004 |
Date of withdrawal: | |
ICS: | 31.240 |
Sorting character/National clasification code | 35 8791 |
Level of incorporation: | idt IEC 60191-6-4:2003, idt EN 60191-6-4:2003 |
Official Journal | 02/04 |
Amendments | |
Replaced by: | |
Repleces: | |
Note in Official Journal: | |
Subject of the standard: |