STN EN 60749-20
| Name: | STN EN 60749-20 |
| Validity: | Withdrawn |
| Number of pages: | 32 |
| Language: |
EN
|
| Paper: | 17,20€ |
| Electronic version |
a) Only read (without ability to print and copy)
15,48€ b) Without ability to print, with ability to copy (printscreen) 17,20€ c) With ability to print and copy (printscreen) 22,36€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 20: Odolnosť plastových puzdier SMD proti kombinovanému pôsobeniu vlhka a spájkovacieho tepla |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| Release Date: | 01. 04. 2010 |
| Date of withdrawal: | 05. 10. 2023 |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt IEC 60749-20:2008, idt EN 60749-20:2009 |
| Official Journal | 03/10 |
| Amendments | |
| Replaced by: | STN EN IEC 60749-20:2021-01 (35 8799) |
| Repleces: | STN EN 60749-20:2004-01 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: |