STN EN IEC 61190-1-3
| Name: | STN EN IEC 61190-1-3 |
| Validity: | Valid |
| Number of pages: | 50 |
| Language: |
EN
|
| Paper: | 18,90€ |
| Electronic version |
a) Only read (without ability to print and copy)
17,01€ b) Without ability to print, with ability to copy (printscreen) 18,90€ c) With ability to print and copy (printscreen) 24,57€ |
| Slovak title | Spájacie materiály pre elektronické zostavy. Časť 1-3: Požiadavky na spájkovacie zliatiny pre elektroniku a pevné spájky s tavidlom alebo bez neho na spájkovanie elektronických výrobkov |
| English title | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| Release Date: | 01. 02. 2019 |
| Date of withdrawal: | |
| ICS: | 31.190 |
| Sorting character/National clasification code | 34 6520 |
| Level of incorporation: | idt EN IEC 61190-1-3:2018, idt IEC 61190-1-3:2017 |
| Official Journal | 01/19 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 61190-1-3:2008-02 (34 6520) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys. |
| Preview: | Náhľad normy (PDF) |