STN EN IEC 62878-1
| Name: | STN EN IEC 62878-1 |
| Validity: | Valid |
| Number of pages: | 29 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Technológia montáže zabudovaných súčiastok. Časť 1: Kmeňová špecifikácia pre substráty so zabudovanými súčiastkami |
| English title | Device embedding assembly technology - Part 1: Generic specification for device embedded substrates |
| Release Date: | 01. 04. 2020 |
| Date of withdrawal: | |
| ICS: | 31.180, 31.190 |
| Sorting character/National clasification code | 34 6510 |
| Level of incorporation: | idt EN IEC 62878-1:2019, idt IEC 62878-1:2019 |
| Official Journal | 03/20 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421. |
| Preview: | Náhľad normy (PDF) |