STN EN IEC 60749-15
| Name: | STN EN IEC 60749-15 |
| Validity: | Valid |
| Number of pages: | 16 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 15: Odolnosť súčiastok na montáž priechodnými otvormi proti spájkovacej teplote |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| Release Date: | 01. 01. 2021 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-15:2020, idt IEC 60749-15:2020 |
| Official Journal | 12/20 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-15:2011-04 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. |
| Preview: | Náhľad normy (PDF) |