STN EN IEC 60749-20
| Name: | STN EN IEC 60749-20 |
| Validity: | Valid |
| Number of pages: | 36 |
| Language: |
EN
|
| Paper: | 17,20€ |
| Electronic version |
a) Only read (without ability to print and copy)
15,48€ b) Without ability to print, with ability to copy (printscreen) 17,20€ c) With ability to print and copy (printscreen) 22,36€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 20: Odolnosť plastových puzdier SMD proti kombinovanému pôsobeniu vlhka a spájkovacieho tepla |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| Release Date: | 01. 01. 2021 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-20:2020, idt IEC 60749-20:2020 |
| Official Journal | 12/20 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-20:2010-04 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes. |
| Preview: | Náhľad normy (PDF) |