STN EN IEC 61188-6-2
| Name: | STN EN IEC 61188-6-2 |
| Validity: | Valid |
| Number of pages: | 32 |
| Language: |
EN
|
| Paper: | 17,20€ |
| Electronic version |
a) Only read (without ability to print and copy)
15,48€ b) Without ability to print, with ability to copy (printscreen) 17,20€ c) With ability to print and copy (printscreen) 22,36€ |
| Slovak title | Dosky s plošnými spojmi a zostavy dosiek s plošnými spojmi. Konštrukcia a používanie. Časť 6-2: Návrh plošných spojov. Popis plošných spojov pre najbežnejšie komponenty montované na povrch |
| English title | Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) |
| Release Date: | 01. 07. 2021 |
| Date of withdrawal: | |
| ICS: | 31.180, 31.190 |
| Sorting character/National clasification code | 34 6512 |
| Level of incorporation: | idt EN IEC 61188-6-2:2021, idt IEC 61188-6-2:2021 |
| Official Journal | 06/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017. |
| Preview: | Náhľad normy (PDF) |