STN EN IEC 61188-6-1
Name: | STN EN IEC 61188-6-1 |
Validity: | Valid |
Number of pages: | 40 |
Language: |
EN
|
Paper: | 18,90€ |
Electronic version |
a) Only read (without ability to print and copy)
17,01€ b) Without ability to print, with ability to copy (printscreen) 18,90€ c) With ability to print and copy (printscreen) 24,57€ |
Slovak title | Dosky s plošnými spojmi a zostavy dosiek s plošnými spojmi. Konštrukcia a používanie. Časť 6-1: Návrh plošných spojov. Všeobecné požiadavky na návrh plošných spojov na doskách |
English title | Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards |
Release Date: | 01. 08. 2021 |
Date of withdrawal: | |
ICS: | 31.180, 31.190 |
Sorting character/National clasification code | 34 6512 |
Level of incorporation: | idt EN IEC 61188-6-1:2021, idt IEC 61188-6-1:2021 |
Official Journal | 07/21 |
Amendments | |
Replaced by: | |
Repleces: | STN EN 61188-5-1:2003-04 (34 6512) |
Note in Official Journal: | |
Subject of the standard: | IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. |
Preview: | Náhľad normy (PDF) |