STN EN IEC 61189-5-301
| Name: | STN EN IEC 61189-5-301 |
| Validity: | Valid |
| Number of pages: | 40 |
| Language: |
EN
|
| Paper: | 18,90€ |
| Electronic version |
a) Only read (without ability to print and copy)
17,01€ b) Without ability to print, with ability to copy (printscreen) 18,90€ c) With ability to print and copy (printscreen) 24,57€ |
| Slovak title | Skúšobné metódy na elektrotechnické materiály, dosky s plošnými spojmi a iné spájacie štruktúry a zostavy. Časť 5-301: Všeobecné skúšobné metódy na materiály a zostavy. Spájkovacia pasta s použitím jemných častíc spájky |
| English title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles |
| Release Date: | 01. 08. 2021 |
| Date of withdrawal: | |
| ICS: | 31.180 |
| Sorting character/National clasification code | 34 6513 |
| Level of incorporation: | idt EN IEC 61189-5-301:2021, idt IEC 61189-5-301:2021 |
| Official Journal | 07/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods. |
| Preview: | Náhľad normy (PDF) |