STN EN IEC 61189-2-807
| Name: | STN EN IEC 61189-2-807 |
| Validity: | Valid |
| Number of pages: | 16 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Skúšobné metódy na elektrotechnické materiály, dosky s plošnými spojmi a iné spájacie štruktúry a zostavy. Časť 2-807: Skúšobné metódy na materiály na spájacie štruktúry. Teplota rozkladu (Td) pomocou TGA |
| English title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA |
| Release Date: | 01. 01. 2022 |
| Date of withdrawal: | |
| ICS: | 31.180 |
| Sorting character/National clasification code | 34 6513 |
| Level of incorporation: | idt IEC 61189-2-807:2021, idt EN IEC 61189-2-807:2021 |
| Official Journal | 12/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). |
| Preview: | Náhľad normy (PDF) |