STN EN IEC 61189-2-501
Name: | STN EN IEC 61189-2-501 |
Validity: | Valid |
Number of pages: | 24 |
Language: |
EN
|
Paper: | 14,10€ |
Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
Slovak title | Skúšobné metódy na elektrotechnické materiály, dosky s plošnými spojmi a iné spájacie štruktúry a zostavy. Časť 2-501: Skúšobné metódy na materiály na spájacie štruktúry. Meranie pružnosti a retenčný faktor odolnosti pružných dielektrických materiálov |
English title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials |
Release Date: | 01. 07. 2022 |
Date of withdrawal: | |
ICS: | 31.180 |
Sorting character/National clasification code | 34 6513 |
Level of incorporation: | idt EN IEC 61189-2-501:2022, idt IEC 61189-2-501:2022 |
Official Journal | 06/22 |
Amendments | |
Replaced by: | |
Repleces: | |
Note in Official Journal: | |
Subject of the standard: | This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN. |
Preview: | Náhľad normy (PDF) |