STN EN IEC 63251
| Name: | STN EN IEC 63251 |
| Validity: | Valid |
| Number of pages: | 28 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Skúšobná metóda pre mechanické vlastnosti flexibilných dosiek s optoelektrickými obvodmi pri tepelnom namáhaní |
| English title | Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress |
| Release Date: | 01. 02. 2024 |
| Date of withdrawal: | |
| ICS: | 31.180 |
| Sorting character/National clasification code | 34 6513 |
| Level of incorporation: | idt EN IEC 63251:2023, idt IEC 63251:2023 |
| Official Journal | 01/24 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress. |
| Preview: | Náhľad normy (PDF) |