STN EN IEC 60749-5
| Name: | STN EN IEC 60749-5 |
| Validity: | Valid |
| Number of pages: | 16 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 5: Skúška životnosti pod vplyvom stáleho vlhkého tepla |
| English title | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| Release Date: | 01. 04. 2024 |
| Date of withdrawal: | |
| ICS: | 31.080.01 |
| Sorting character/National clasification code | 35 8799 |
| Level of incorporation: | idt EN IEC 60749-5:2024, idt IEC 60749-5:2023 |
| Official Journal | 03/24 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN 60749-5:2018-01 (35 8799) |
| Note in Official Journal: | |
| Subject of the standard: | IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”. |
| Preview: | Náhľad normy (PDF) |