STN EN ISO 9455-17
| Name: | STN EN ISO 9455-17 |
| Validity: | Valid |
| Number of pages: | 32 |
| Language: |
EN
|
| Paper: | 17,20€ |
| Electronic version |
a) Only read (without ability to print and copy)
15,48€ b) Without ability to print, with ability to copy (printscreen) 17,20€ c) With ability to print and copy (printscreen) 22,36€ |
| Slovak title | Tavivá na mäkké spájkovanie. Skúšobné metódy. Časť 17: Skúška na stanovenie izolačného odporu povrchu strhávaním a skúška elektrochemickej migrácie zvyškov taviva (ISO 9455-17: 2024) |
| English title | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024) |
| Release Date: | 01. 07. 2024 |
| Date of withdrawal: | |
| ICS: | 25.160.50 |
| Sorting character/National clasification code | 05 5602 |
| Level of incorporation: | idt ISO 9455-17:2024, idt EN ISO 9455-17:2024 |
| Official Journal | 06/24 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN ISO 9455-17:2006-12 (05 5602) |
| Note in Official Journal: | |
| Subject of the standard: | This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer. |
| Preview: | Náhľad normy (PDF) |