STN EN IEC 62878-2-603
| Name: | STN EN IEC 62878-2-603 |
| Validity: | Valid |
| Number of pages: | 20 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Technológia montáže zabudovaných súčiastok. Časť 2-603: Pokyny pre stohovací elektronický modul. Skúšobná metóda vnútromodulovej elektrickej konektivity |
| English title | Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity |
| Release Date: | 01. 07. 2025 |
| Date of withdrawal: | |
| ICS: | 31.180, 31.190 |
| Sorting character/National clasification code | 34 6510 |
| Level of incorporation: | idt EN IEC 62878-2-603:2025, idt IEC 62878-2-603:2025 |
| Official Journal | 06/25 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM). |
| Preview: | Náhľad normy (PDF) |