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STN EN IEC 60749-22-1

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Electronic version (pdc file)

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Name: STN EN IEC 60749-22-1
Validity: Valid
Number of pages: 68
Language:
EN
Paper: 24,40€
Electronic version a) Only read (without ability to print and copy) 21,96€
b) Without ability to print, with ability to copy (printscreen) 24,40€
c) With ability to print and copy (printscreen) 31,72€
Slovak title Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 22-1: Pevnosť spojenia. Skúšobné metódy ťahom drôteného spoja
English title Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
Release Date: 01. 04. 2026
Date of withdrawal:
ICS: 31.080.01
Sorting character/National clasification code 35 8799
Level of incorporation: idt EN IEC 60749-22-1:2026, idt IEC 60749-22-1:2025
Official Journal 03/26
Amendments
Replaced by:
Repleces: STN EN 60749-22:2004-01 (35 8799)
Note in Official Journal:
Subject of the standard: IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024"). This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance. This test method allows for two distinct methods of pulling wires: a) One method incorporates the use of a hook that is placed under the wire and is then pulled. b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp ...
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