STN EN IEC 60749-22-1
| Označenie: | STN EN IEC 60749-22-1 |
| Platnosť: | Platná |
| Počet strán: | 68 |
| Jazyk: |
EN
|
| Listinná verzia: | 24,40€ |
| Elektronická verzia: |
a) Bez možnosti tlače, prenosu textu a obrázkov:
21,96€ b) Bez možnosti tlače, s prenosom textu a obrázkov: 24,40€ c) S možnosťou tlače, prenosu textu a obrázkov: 31,72€ |
| Slovenský názov: | Polovodičové súčiastky. Mechanické a klimatické skúšobné metódy. Časť 22-1: Pevnosť spojenia. Skúšobné metódy ťahom drôteného spoja |
| Anglický názov: | Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods |
| Dátum vydania: | 01. 04. 2026 |
| Dátum zrušenia: | |
| ICS: | 31.080.01 |
| Triediaci znak: | 35 8799 |
| Úroveň zapracovania: | idt EN IEC 60749-22-1:2026, idt IEC 60749-22-1:2025 |
| Vestník: | 03/26 |
| Zmeny: | |
| Nahradzujúce normy: | |
| Nahradené normy: | STN EN 60749-22:2004-01 (35 8799) |
| Poznámka vo Vestníku: | |
| Predmet normy: | IEC 60749-22-1:2025 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024"). This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance. This test method allows for two distinct methods of pulling wires: a) One method incorporates the use of a hook that is placed under the wire and is then pulled. b) One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp ... |
| Náhľad normy: | Náhľad normy (PDF) |