STN EN ISO 9455-5
| Name: | STN EN ISO 9455-5 |
| Validity: | Valid |
| Number of pages: | 16 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Tavivá na mäkké spájkovanie. Skúšobné metódy. Časť 5: Skúška medeným zrkadlom (ISO 9455-5: 2020) |
| English title | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2020) |
| Release Date: | 01. 04. 2021 |
| Date of withdrawal: | |
| ICS: | 25.160.50 |
| Sorting character/National clasification code | 05 5707 |
| Level of incorporation: | idt ISO 9455-5:2020, idt EN ISO 9455-5:2020 |
| Official Journal | 03/21 |
| Amendments | |
| Replaced by: | |
| Repleces: | STN EN ISO 9455-5:2015-02 (05 5707) |
| Note in Official Journal: | |
| Subject of the standard: | This document specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454-1. |
| Preview: | Náhľad normy (PDF) |