STN EN IEC 61189-2-808
| Name: | STN EN IEC 61189-2-808 |
| Validity: | Valid |
| Number of pages: | 28 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Skúšobné metódy na elektrotechnické materiály, dosky s plošnými spojmi a iné spájacie štruktúry a zostavy. Časť 2-808: Tepelný odpor zostavy metódou tepelných prechodov |
| English title | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method |
| Release Date: | 01. 08. 2024 |
| Date of withdrawal: | |
| ICS: | 31.180 |
| Sorting character/National clasification code | 34 6513 |
| Level of incorporation: | idt EN IEC 61189-2-808:2024, idt IEC 61189-2-808:2024 |
| Official Journal | 07/24 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A. |