STN EN IEC 61189-3-302
| Name: | STN EN IEC 61189-3-302 |
| Validity: | Valid |
| Number of pages: | 24 |
| Language: |
EN
|
| Paper: | 14,10€ |
| Electronic version |
a) Only read (without ability to print and copy)
12,69€ b) Without ability to print, with ability to copy (printscreen) 14,10€ c) With ability to print and copy (printscreen) 18,33€ |
| Slovak title | Skúšobné metódy na elektrotechnické materiály, dosky s plošnými spojmi a iné spájacie štruktúry a zostavy. Časť 3-302: Zisťovanie vád pokovovania na neosadených doskách plošných spojov počítačovou tomografiou (CT) |
| English title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) |
| Release Date: | 01. 04. 2026 |
| Date of withdrawal: | |
| ICS: | 31.180 |
| Sorting character/National clasification code | 34 6513 |
| Level of incorporation: | idt EN IEC 61189-3-302:2025, idt IEC 61189-3-302:2025 |
| Official Journal | 03/26 |
| Amendments | |
| Replaced by: | |
| Repleces: | |
| Note in Official Journal: | |
| Subject of the standard: | IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes. |
| Preview: | Náhľad normy (PDF) |